EoPlex’s CSI™ QFN provides a superior alternative to traditional QFN packaging. CSI™ QFN is fundamentally different because of the technology and process used to print an array of wire bond pads, die attach pads, and ground rings onto a temporary carrier which is removed after die attach and wirebonding. The CSI™ QFN offers much improved size, cost, and performance efficiencies highlighted below and is compatible with standard manufacturing processes.

For more information, please contact EoPlex.

Benefits Include:

App Lower total cost of ownership

App High Lead Count, 500+

App Total package thickness down to 230μ

App Minimum metal = better electrical performance

App Excellent thermal performance

App Packages are electrically isolated for strip testing

App Cutting through plastic only is faster and extends blade life

App No plating or etching - “green process”